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Press Release
Interplex Metals Offers Lead-Free Plating Alternatives
Flushing, NY - February 14, 2005 - Interplex Metals, a division of Interplex Industries, announced today that it is offering a new lead-free electroplating capability. This lead free plating process is comprised of a lead-free whisker mitigating tin chemistry combined with state of the art in-line reflow technology.
Pure tin deposits are quickly becoming a substitute for tin-lead deposits in the electroplating process to create lead-free products. However, pure tin deposits are known for creating "whiskers" that compromise electrical performance. The cause of these whiskers has been attributed to the natural mechanical stresses associated with the use of pure tin.
"Reflowing the electroplated tin deposit eliminates virtually all of the internal stresses of the pure tin deposit, while retaining excellent solderability" said Rob Souza, General Manager of Interplex Metals. "Although the system is designed to utilize both the whisker mitigating chemistry and the in-line reflow technology, we also have the flexibility to provide the customer with either one of these technologies independently"
"In response to more stringent environmental regulations, companies worldwide are eliminating the use of lead in their products," said Jack Seidler, Chairman and CEO of Interplex Industries. "The new Interplex Metals' lead-free plating process utilizes proven chemistries and state of the art in-line reflow technologies to achieve this objective. We are confident that this process will allow our customers to maintain product integrity while complying with these new regulations."
Headquartered in Flushing, NY, Interplex Industries has provided precision metal stamping, electroplating, insert and injection molding, metal etching and assembly services around the world since 1958. Interplex currently provides its services to the automotive, communications, consumer, electronics, industrial and medical markets. The company has facilities in the United States, Mexico, China, Singapore, India, Scotland, France and Germany.
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